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Your search returned 24 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1996 Volume number : 19 Issue: 03 |
Modeling, Measurement, And Simulation Of Simultaneous Switching Noise
(Article)
Subject:
Modeling
,
Measurement
,
Switching
Author:
Bradley D.
Mccredie
Wiren D.
Becker
page:
461
-
472
Design Trade-Offs For The Last Stage Of An Unregulated, Long-Channel Cmos Off-Chip Driver With Simultaneous Switching Noise And Switching Time Considerations
(Article)
Subject:
Design Trade-Offs
,
Last Byte
,
Time Consuming Process
Author:
Yaowu
Wang
J. R
Brews
page:
481
-
486
Multireflection Algorithm For Timed Statistical Coupled Noise Checking
(Article)
Subject:
Multirate
,
Timed Automation
,
Noise
Author:
Howard H.
Smith
George A.
Katopis
page:
503
-
511
A Surface Mount Single-Mode Laser Module Using Passive Alignment
(Article)
Subject:
Optical Communication
,
Semiconducters
,
Alignment
Author:
Kazuhiko
Kurata
Kenji
Yamauchi
Shigeta
Ishikawa
page:
524
-
531
A Low-Cost High-Performance Optical Interconnect
(Article)
Subject:
Optical Interconnect
,
Parallelism
,
Fiber Reuse
,
Vcsels By Elliqtic Surface Etching
Author:
Daniel B.
Schwartz
Brian
Webb
page:
532
-
539
622 Mb S Channel Parallel Digital Optical Receiver Array Module Using Hybrid Packaging
(Article)
Subject:
Optical Communication
,
Optical Receiver
,
Parallel Algorithms
Author:
Sabeur
Siala
Vinodkumar
Ramakrishnan
Richard N.
Nottenburg
page:
548
-
553
Optical Performance Of Low-Cost Self-Aligned Mcm-D Based Optical Data Links
(Article)
Subject:
Optical
,
Low-Cost
,
Data Logger
Author:
Mino F.
Dautartas
G
Benzoni
M.
Moser
page:
554
-
561
Design Of A Compact, High Speed Optical Transceiver Using Two Step Overmolding
(Article)
Subject:
High Speed
,
Transceiver
,
High-Vacuum Systems
Author:
Felix C. J.
Anigbo
Steven D.
Robinson
D.
Stefanik
page:
562
-
568
A Packaging Technique For An Optical 90 -Hybrid Balanced Receiver Using A Planar Lightwave Circuit
(Article)
Subject:
Receiver Module
,
Silica
,
Impedance
Author:
Hideki
Tsunetsugu
Susumu
Hata
Noboru
Takachio
page:
569
-
574
Low Temperature Bonding Of Epitaxial Lift Off Devices With Ausn
(Article)
Subject:
Optoelectronic
,
Epitaxial Layers
,
Bonding
Author:
G. Rainer
Dohle
Timothy J.
Drabik
Kevin B.
Martin
page:
575
-
580
Level 1 Crackfree Plastic Packaging Technology
(Article)
Subject:
Level Crossings
,
Packaging
,
Technology
Author:
Eric D.
Perfecto
Cary
Aewis
Hhhhoward
Berg
page:
581
-
584
Advanced Copna-Resin As A Low Temperature Curing Resin For High-Density Electronic Packages
(Article)
Subject:
Mcm
,
Small Worlds
,
Low Temperature
,
Advanced
Author:
Kazunari
Nawa
Sakae
Ueda
Hideyuki
Watanabe
page:
585
-
892
Numerical Stress Analysis Of Resin Cracking In Lsi Plastic Packages Under Temperature Cyclic Loading
(Article)
Subject:
Numerical
,
Under The Hood
,
Cyclic
Author:
Takehiro
Saitoh
page:
593
-
600
Measurements Of The Novel Thermal Conduction Of A Porphoritic Heat Sink Paste
(Article)
Subject:
Heat Sink
,
Thermal Conductivity
,
Thermal
Author:
Raymonde G. C,
Artus
page:
601
-
604
Interconnect Propagation Delay Modeling And Validation For The 16-Mb Cmos Sram Chip
(Article)
Subject:
Interconnect
,
Comos Driver
,
Sram
Author:
Venkatapathi
Rayapati
Bozena
Kaminska
page:
605
-
614
A Combined Finite Difference And Analytic Expression Approach To Crossover Capacitance In A Multilayer Dielectric Environment
(Article)
Subject:
Combined Fermentation
,
Analytic Approach
,
Dielectric
Author:
Guanghua
Pan
Mikhail
Toupikov
Barry K.
Gibert
page:
615
-
620
Full Wave Analysis Of Transmission Lines In A Multilayer Substrate With Heavy Dielectric Losses
(Article)
Subject:
Cmos
,
Integral Equations
,
Reflection
Author:
Jilin
Tan
Guang-Wen
Pan
Barry K.
Gilbert
page:
621
-
627
Laser-Diode Array Packaging In Opto-Electronic Multichip Modules
(Article)
Subject:
Standard Specification
,
Thermal Ability
,
Fluorinated Polymers
,
Opto-Electronic
Author:
Shin'Ichi
Koike
Shinsuke
Matsui
A
Takahara
page:
628
-
634
High Q-Factor Inductors Integrated On Mcm Si Substrates
(Article)
Subject:
High Field
,
Induced Air Flotation
,
Substrate
Author:
K
Tai
Larry
Zu
Sheue-Chyn
Sandy
page:
635
-
643
Anisotropically Conductive Adhesive Flip-Chip Bonding On Rigid And Flexible Printed Circuit Substrates
(Article)
Subject:
Flip-Chip
,
Anisotropic
,
Failure Mechanism
Author:
Zonghe
Lai
Johan
Liu
page:
644
-
660
Reliability Studies Of Surface Mount Solder Joints - Effect Of Cu-Sn Intermetallic Compounds
(Article)
Subject:
Reliability
,
Effect
,
Compounds
Author:
Alex C. K.
So
Yan C.
Chan
page:
661
-
668
Fatigue Life Estimation Of Surface Mount Solder Joints
(Article)
Subject:
Surface Mount Technology
,
Fatigue
,
Solder Joint Reliability
Author:
D
Xie
I. K.
Hui
J. K. L.
Lai
page:
669
-
678
Fatigue Life Estimation Of Surface Mount Solder Joints
(Article)
Subject:
Author:
page:
669
-
678
Fatigue Life Studies On Defect-Free Solder Joints Fabricated From Modified Reflow Soldering
(Article)
Subject:
Fatigue
,
Solder-Joint Inspection
,
Soldering
Author:
D
Xie
Yan C.
Chan
J. K. L.
Lai
page:
679
-
684
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