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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging

Year : 1996 Volume number : 19 Issue: 03

Modeling, Measurement, And Simulation Of Simultaneous Switching Noise (Article)
Subject: Modeling , Measurement , Switching
Author: Bradley D. Mccredie      Wiren D. Becker     
page:      461 - 472
Design Trade-Offs For The Last Stage Of An Unregulated, Long-Channel Cmos Off-Chip Driver With Simultaneous Switching Noise And Switching Time Considerations (Article)
Subject: Design Trade-Offs , Last Byte , Time Consuming Process
Author: Yaowu Wang      J. R Brews     
page:      481 - 486
Multireflection Algorithm For Timed Statistical Coupled Noise Checking (Article)
Subject: Multirate , Timed Automation , Noise
Author: Howard H. Smith      George A. Katopis     
page:      503 - 511
A Surface Mount Single-Mode Laser Module Using Passive Alignment (Article)
Subject: Optical Communication , Semiconducters , Alignment
Author: Kazuhiko Kurata      Kenji Yamauchi      Shigeta Ishikawa     
page:      524 - 531
A Low-Cost High-Performance Optical Interconnect (Article)
Subject: Optical Interconnect , Parallelism , Fiber Reuse , Vcsels By Elliqtic Surface Etching
Author: Daniel B. Schwartz      Brian Webb     
page:      532 - 539
622 Mb S Channel Parallel Digital Optical Receiver Array Module Using Hybrid Packaging (Article)
Subject: Optical Communication , Optical Receiver , Parallel Algorithms
Author: Sabeur Siala      Vinodkumar Ramakrishnan      Richard N. Nottenburg     
page:      548 - 553
Optical Performance Of Low-Cost Self-Aligned Mcm-D Based Optical Data Links (Article)
Subject: Optical , Low-Cost , Data Logger
Author: Mino F. Dautartas      G Benzoni      M. Moser     
page:      554 - 561
Design Of A Compact, High Speed Optical Transceiver Using Two Step Overmolding (Article)
Subject: High Speed , Transceiver , High-Vacuum Systems
Author: Felix C. J. Anigbo      Steven D. Robinson      D. Stefanik     
page:      562 - 568
A Packaging Technique For An Optical 90 -Hybrid Balanced Receiver Using A Planar Lightwave Circuit (Article)
Subject: Receiver Module , Silica , Impedance
Author: Hideki Tsunetsugu      Susumu Hata      Noboru Takachio     
page:      569 - 574
Low Temperature Bonding Of Epitaxial Lift Off Devices With Ausn (Article)
Subject: Optoelectronic , Epitaxial Layers , Bonding
Author: G. Rainer Dohle      Timothy J. Drabik      Kevin B. Martin     
page:      575 - 580
Level 1 Crackfree Plastic Packaging Technology (Article)
Subject: Level Crossings , Packaging , Technology
Author: Eric D. Perfecto      Cary Aewis      Hhhhoward Berg     
page:      581 - 584
Advanced Copna-Resin As A Low Temperature Curing Resin For High-Density Electronic Packages (Article)
Subject: Mcm , Small Worlds , Low Temperature , Advanced
Author: Kazunari Nawa      Sakae Ueda      Hideyuki Watanabe     
page:      585 - 892
Numerical Stress Analysis Of Resin Cracking In Lsi Plastic Packages Under Temperature Cyclic Loading (Article)
Subject: Numerical , Under The Hood , Cyclic
Author: Takehiro Saitoh     
page:      593 - 600
Measurements Of The Novel Thermal Conduction Of A Porphoritic Heat Sink Paste (Article)
Subject: Heat Sink , Thermal Conductivity , Thermal
Author: Raymonde G. C, Artus     
page:      601 - 604
Interconnect Propagation Delay Modeling And Validation For The 16-Mb Cmos Sram Chip (Article)
Subject: Interconnect , Comos Driver , Sram
Author: Venkatapathi Rayapati      Bozena Kaminska     
page:      605 - 614
A Combined Finite Difference And Analytic Expression Approach To Crossover Capacitance In A Multilayer Dielectric Environment (Article)
Subject: Combined Fermentation , Analytic Approach , Dielectric
Author: Guanghua Pan      Mikhail Toupikov      Barry K. Gibert     
page:      615 - 620
Full Wave Analysis Of Transmission Lines In A Multilayer Substrate With Heavy Dielectric Losses (Article)
Subject: Cmos , Integral Equations , Reflection
Author: Jilin Tan      Guang-Wen Pan      Barry K. Gilbert     
page:      621 - 627
Laser-Diode Array Packaging In Opto-Electronic Multichip Modules (Article)
Subject: Standard Specification , Thermal Ability , Fluorinated Polymers , Opto-Electronic
Author: Shin'Ichi Koike      Shinsuke Matsui      A Takahara     
page:      628 - 634
High Q-Factor Inductors Integrated On Mcm Si Substrates (Article)
Subject: High Field , Induced Air Flotation , Substrate
Author: K Tai      Larry Zu      Sheue-Chyn Sandy     
page:      635 - 643
Anisotropically Conductive Adhesive Flip-Chip Bonding On Rigid And Flexible Printed Circuit Substrates (Article)
Subject: Flip-Chip , Anisotropic , Failure Mechanism
Author: Zonghe Lai      Johan Liu     
page:      644 - 660
Reliability Studies Of Surface Mount Solder Joints - Effect Of Cu-Sn Intermetallic Compounds (Article)
Subject: Reliability , Effect , Compounds
Author: Alex C. K. So      Yan C. Chan     
page:      661 - 668
Fatigue Life Estimation Of Surface Mount Solder Joints (Article)
Subject: Surface Mount Technology , Fatigue , Solder Joint Reliability
Author: D Xie      I. K. Hui      J. K. L. Lai     
page:      669 - 678
Fatigue Life Estimation Of Surface Mount Solder Joints (Article)
Subject:
Author:
page:      669 - 678
Fatigue Life Studies On Defect-Free Solder Joints Fabricated From Modified Reflow Soldering (Article)
Subject: Fatigue , Solder-Joint Inspection , Soldering
Author: D Xie      Yan C. Chan      J. K. L. Lai     
page:      679 - 684